Jiangsu Xinmeng Semiconductor Equipment Co., Ltd

  • Add:  Building 7,  Chengnan Science and Technology Industrial Park, No. 25 Dongwu South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

  • Tel：+086 0512-67296032

  • Fax：+086 0512-67296032

  • Email：sales@js-xm.com.cn

Suzhou Foupclean Semiconductor Equipment Co., Ltd.

  • Add:  Building 7,  Chengnan Science and Technology Industrial Park, No. 25 Dongwu South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

  • Tel：+086 0512-67296032

  • Fax：+086 0512-67296032

  • Email：sales@foupclean.com

  • Strategic Cooperation：fuxing.wang@js-xm.com.cn

  • Tech communion：louis.shao@js-xm.com.cn

  • Supply chain：sunshine@js-xm.com.cn

Ethics whistleblower hotline

  • To report any possible violations of the Xinmeng Semiconductor Charter and Policies, please contact:

  • SUNSHINE@JS-XM.COM.CN

  • Tel：+086 0512-67296032

Single Wafer Wet Process Equipment

三維封裝TSV微盲孔電鍍填充設(shè)備

團(tuán)隊(duì)有半導(dǎo)體制造、材料十多年行業(yè)服務(wù)經(jīng)驗(yàn)

核心技術(shù)來源:在02專項(xiàng)/973項(xiàng)目支持下，獲得了關(guān)鍵技術(shù)的突破

三維封裝TSV微盲孔電鍍填充設(shè)備

自創(chuàng)復(fù)合添加劑技術(shù)

復(fù)合添加劑equilibrium LUMO

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添加劑的電化學(xué)測(cè)試

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復(fù)合添加劑實(shí)現(xiàn)TSV完全自底向上填充 （ 20*120μm ）

image34-600x638.png

基于理論精準(zhǔn)建模

大深寬比TSV鍍銅填充模型

image32-768x457.png

物理場(chǎng)增強(qiáng)技術(shù)

超聲及脈沖增強(qiáng)機(jī)制

image37-600x367.png

超聲對(duì)200×20 μm TSV鍍銅填充的影響

image38-600x380.png

無超聲與有超聲

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模擬仿真和設(shè)計(jì)

關(guān)鍵模塊之一 電鍍液分布與電流分布

image41 (1).pngimage42 (1).jpegimage43 (1).png